Electromechanical, Plastic Parts & Industrial Design

TEN TECH LLC's Mechanical Design Division specializes in Electromechanical Design and Packaging, providing expertise in the following areas:

• Avionics Packaging of Airborne Electronics
• ATR Equipment, ARINC 600 & 404 standards
• Electro-optical Systems
• Design Ruggedization
• Sheetmetal & Machined Parts
• Injection Molding Plastic Parts Design
• EMI Electromechanical Packaging
• Tolerance Analysis & ANSI-Y14.5 GD&T
• Harness & Cable Management Design
• Conceptual Design & Industrial Design
Backplane Chassis Avionics Design
We have a vast amount of experience in the design of custom chassis utilizing dip and vacuum brazed methods as well as epoxy adhesive bonding for structural reinforcement and EMI prevention. TEN TECH LLC's design methods adhere to the most rigorous commercial and military specifications, including RTCA/DO-160, MIL-STD-810, MIL-STD-901 and MIL-STD-1472. Technical Data Packages we deliver are fully compliant with MIL-DTL-31000 standard.
TEN TECH LLC is officially a "VITA 48.7 Air Flow-By™" Design-capable Supplier.

Air Flow-By™ (AFB) is the ANSI/VITA 48.7-ratified open standard for the efficient cooling of OpenVPX™ processing systems. Over the past 6 years, TEN TECH LLC has gained in-depth knowledge of the AFB technology and its performance, working closely with Mercury Systems on its deployment on various manned and unmanned airborne platforms.

As a Design-capable Supplier of VITA 48.7 Air Flow-By™, TEN TECH LLC can assist in the design, conversion and performance evaluation of any OpenVPX™ modules and systems.
VITA 48.7 Air Flow-By™ Module
The engineers at TEN TECH LLC use the most advanced 2D & 3D CAD systems to perform complete Digital Design, including:

• 2D Drawings & Review Packages
• 3D Modeling for Parts, Assemblies
• Organic Shapes, Styling and Class-A Surfacing
• Point Cloud Processing & Reverse Engineering
• Generative Design for Additive Manufacturing
• Artistic & Realistic 3D Renderings
Generative Design Topology Optimization
TEN TECH A&D supports the development of Advanced RF System-in-Package (RF-SiP) components. Our engineers bring expertise in many key areas of electronics components design & engineering, including:

• Substrate, Interposer & BGA material selections
• Interconnects Sizing (TSV, BGA pitch, …)
• Manufacturability & Reworkability
• Internal & External Thermal Management
• Integration into Higher-level Assemblies
• Harsh Environments Survivability
• Low & High Cycle Fatigue & Durability Prediction
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  • 3DS CATIA V5
  • 3DS Solidworks
  • 3DS Draftsight
  • Blender 3D
  • PTC Creo
  • Luxion Keyshot
  • AUtodesh Fusion 360
  • SolidEdge
  • ANSYS Spaceclaim
  • AutoCAD
  • AMD Radeon Prorender
  • Solid Thinking INSPIRE
  • Siemens Unigraphics NX
  • Solid Thinking Evolve
Huracan Fusion360 CAD Design
Huracan Quadcopter Rendering
CATIA Aircraft Fuselage Design
CATIA Aerospace Satellite Design
CATIA Ship Naval Design GSD
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